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| Introduction to AMHS system |
|---|
| AMHS: automatic material handling system |
| AGV: Automatic Guided Vehicles |
| OHS: Overhead Shuttle |
| CLL: Clean Lifer |
| MGV: Manual Guided |
| MES: Manufacture Executive System |
| PLC: Programmable Logic Controller |
| IR: infrared |
| IFIR: infrared interface |
| CCU: Central Control Unit |
| SCU: Section Control Unit |
| TFT-LCD: Thin-film Transistor Liquid Crystal Display |
| CLL: clean lifter (crane) |
| STK: stocker |
| MIF: Mechanical Interface |
| EQ: equipment |
| SPC: Statistical Process Control |
| SD: State Display |
| HUB: 网络集线器, 网络中心 |
| BCR: Bar Coder Reader |
| DI/O: Data input/output |
| OPT: optical |
| RM: Rack Master |
| RM –i/f: Rack Master Interface |
| PIO: process input/output which is guided by optical sensors |
| P&P: Pick up and Putdown |
| VTC: Vehicle Transfer Controller |
| IRIF: infrared interface, installed under ceiling of the AGV route for communication between NT7000 and AGV. |
| MIP: Local controller for mechanical and electrical parts of stocker. |
| PIO: Optical communication interface installed on the front of equipment when cassette Loading\ Unloading. |
| SCU: section control unit for overhead shuttles, which control (stop\drive)the passing by shuttle within that section. |
| CCU: central control unit for overhead shuttles, for command execution and status report. |
| MCS: module control subsystem transportation control dispatch, equipment status inventory control, transportation logging are its responsibility. |
| TCS: tool control subsystem |
| Introduction of CIM |
| CIM: Computer Integrated Manufacture |
| F A: Factory Automation |
| CFM: Center Flow Monitor It is a signal reflecting whether communication performed or not and whether it go on normally or not . |
| SPC: Statistical Process Control |
| AMS: Alarm system |
| HIS: Historical progress Data Management Historical Quality Data Management |
| EDA: Engineering Data Analysis |
| OPI: Operator Interface |
| BRM: Basic Record Management |
| PPT: Product and Process Tracking (more details offered in OPI lecture explanation) |
| SCH: Schedule Management |
| WCFM: Web Central Floor Management |
| PMS: Preventive Maintenance System |
| ALM: Alarm System |
| BC: Block Control |
| SC: Stocker Controller |
| MCS: module control subsystem transportation control dispatch, equipment status inventory control, transportation logging are its responsibility. |
| TCS: tool control subsystem |
| EQP: equipment |
| AS\RS: Automatic Storage /Retrieval System |
| CEM: Central Flow Monitor |
| PPT: product and process tracking the core of MES |
| RCM: Recipe Control and Management |
| BRM: basic record management |
| SAMP: sampling automation |
| MQC: Machine Quality Check |
| DUMY: dummy sheet for experiment |
| WIP: Work In Process, a lot of semi-manufacture material in module but not in processing. In auto mode control, MES passes message to equipment or sends the information back to MES by TCS. |
| PEWK: rework We have to redo a particular step that has leaded to the defect; or, aborting the panel is unavoidable |
| BRCH: branch route. With the purpose of reinforcing the flexibility, we can adjust our product line timely to whet our customer’s appetites. Setting is like a REWK route, but it is not rework. The product line turn to branch route when the lot’s parameter name\value is as same as equipment’s parameter name\value. It means Condition of branch |
| CRCL: cleaning route for carrier |
| EQTR: Equipment Transition Type |
| DUMY: route for dummy sheet |
| WIP: working in process |
| QRS: Q-Restriction, it has two types. One is Maximum Q-Time; he other is Minimum Q-time; meanwhile, QRS Operation should be processed between them. |
| EC CODE: Engineering Change Code |
| BCS Node: |
| EQRM: Equipment Run Mode |
| EQAR: Equipment Area Code |
| STB:P6 |
| OPI lecture explanation |
| MCS: module control subsystem transportation control dispatch, equipment status inventory control, transportation logging are its |
| responsibility. |
| OPI: operation interface (more details offered in OPI lecture explanation) |
| PPT: Product and Process Tracking (more details offered in OPI lecture explanation) |
| TCS: Tool Control Subsystem In auto mode control, MES passes message to equipment or sends the information back to MES by TCS. |
| REWK: rework We have to redo a particular step that has leaded to the defect; or ,aborting the panel is unavoidable |
| BRCH: branch route. With the purpose of reinforcing the flexibility, we can adjust our product line timely to whet our customer’s appetites. Setting is like a REWK route, but it is not rework. The product line turn to branch route when the lot’s parameter name\value is as same as equipment’s parameter name\value. It means Condition of branch. |
| OPER: operation |
| DEPT: department |
| MQC: machine quality check route. This route is used for only MQC Lot. |
| TCS: tool control subsystem |
| PPT: product and process tracking |
| BR: Basic Record |
| The Common Specification of Equipment Automation for TFT |
| TFT: Thin-Film Transistor |
| CIM: Computer Integrated Manufacture |
| LDRQ: load request |
| LDCM: load complete |
| UDRQ: unload request |
| UDCM: unload complete |
| DOWN: equipment is disable |
| SECS: the communication protocol at TFT shop |
| HSMS: message protocol |
| MSB: most significant byte |
| LSB: least significant byte |
| LOT STATE DEFINITIONS: |
| PROC: processing |
| PREN: process end |
| ABND: abnormal end |
| ABOT: abort end |
| CAEN: cancel end |
| S1F1: S: stream F: function |
| CONTRACT SPECIFICARACT (cell) |
| DFK: DAIFUKU 日本大福公司 |
| BCR: Bar Coder Reader |
| T.B.D: to be determined |
| Electrical Power: AC208V±10% 3P 3W E3 GPS\ EPS |
| GPS: General Power Supply |
| EPS: Emergency Power Supply |
| UPS: Uninterruptible Power supply |
| CLS: Clean Liter System |
| R\M: Rack Master |
| CLL: CLean Lifter |
| CSC: one part of OHS |
| spot Mg: spot magnet |
| SS Radio: Spread Spectrum Radio 展布频谱 |
| MIF: Mechanical Interface |
| LED: Low Emitting Diode, 发光二极管 |
| ODT: Optical Data Transmit |
| MCP7 Master Control Processor number seven |
| MES: Manufacture Executive System |
| MCP: Master Control Processor |
| MCS: Module Control System It bears the responsibility for transportation command dispatch, equipment status Inventory control, transportation logging. |
| BCR: Bar Coder Reader |
| RM –i/f: Rack Master Interface |
| E23: Semi Standard Code |
| SD: Status Display |
| VGC: Vehicle Ground Controller |
| VTC: Vehicle Transfer Controller |
| MCP: Master Control Processor |
| EMS: EMergence Stop |
| R\M: Rack Master |
| NG: NotGood |
| Conv: MGV/AGV I/O Conveyor |
| TFE: Transfer Equipment |
| GUI: Graphic User Interface 图形用户界面 |
| MCBF: Mean Cycle Between Failure |
| DIO: Digital Input/ Output |
| OS: Operation System |
| EMO: Emergence Off When any EMO is pressed, power to the related device is shut down and the device will be stopped. |
| HP: Home Position |
| OP: Opposite Position |
| LAN: 局域網 |
| HDD: Hard Disk |
| FDD: Floppy Disk |
| PCI: Peripheral Component Interconnect 一種接口 |
| FFU: one kind of aerial dust filter |
| KVA: 1000 voltages multiples ampere . It is a unit of Power. |
| GPS: General Power Supply |
| EPS: Emergency Power Supply |
| HID: High Efficiency Inductive Power Distribution |
| MCP: Master Control Processor |
| AP: Access Point |
| Spot Mg: Spot Magnet |
| LFT: Lifter |
| M/L: Maintenance Lifter |
| OHS: Overhead Hoist System |
| -C: controller |
| DC: 直流電源 |
| 其他 |
| TCS：Tool Control System |
| BC：Block Control |
| DCS：Dispatch Control System |
| MCS：Material Control System |
| FA：Factury Automation |
| AS：Automatic Storage |
| RS：Retrieval System |
| EWS：Engineering Workstation Sever |
| SCH： |
| HIS：History |
| OCAP：Out of Control Action Plan，失控行动计划 |
| CST：cassette |
| TAT：Turn Around Time |
| 缩写 | 全称 | 描述 |
|---|---|---|
| BMT | Block Mouting | 粘棒 |
| WSW | Wire Saw | 线切 |
| SWC | Sliced Wafer Cleaning | 脱胶后清洗 |
| SOE | Sliced Orientation Evaluation | 晶向检测 |
| SWE | Sliced Wafer Evaluation | 平坦度检测 |
| 4PP | Four Point | 四探针检测 |
| EDG | Edge Grinding | 倒角 |
| EDE | Edge Grinding Profile Evaluation | 倒角轮廓检测 |
| LAP | Lapping | 磨片 |
| LWE | Lapping Wafer Evaluation | 磨片后检测 |
| HLM | Hard Laser Evaluation | 打标 |
| CAE | Caustic Etching | 碱腐 |
| CEE | Caustic Etching Evaluation | 碱腐后检测 |
| DSP | Double side polishing | 双抛 |
| DPC | Double side polishing cleaning | 双抛后清洗 |
| DWE | DSP Wafer Evaluation | 双抛后检测 |
| EPC | Edge Polishing Wafer Cleaning | 边抛后清洗 |
| CMP | Final Polishing | 最终抛光 |
| CME | Partical Evaluation After CMP | 终抛后颗粒检测 |
| WFI | Wafer Inspection | 终抛后目检仪检测 |
| FNC | Final Cleaning | 最终清洗 |
| EPE | EPI Partical Evaluation(Pre) | 外延前颗粒检测 |
| PKG | Packaging | 包装 |
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