WHITE PAPER 2027
从连接到进化
FROM CONNECTION TO EVOLUTION
2026年，2.3万平米展区实现30亿元意向成交额，78%展商当场复订。 In 2026, 23,000 sqm of exhibition space generated RMB 3 billion in intended transaction value, with 78% of exhibitors re-booking on site.
2027年，展会升级为「赛逸展 」。
In 2027, the show upgrades to SAI Expo.
30亿
意向成交额
Transaction Value
78%
展商复订率
Renewal Rate
94%
展商满意度
Satisfaction
定位 / POSITIONING
决策者密度Decision-Maker Density成交驱动Deal-Driven
全球通道Global Gateway
关键数据 / KEY DATA
62% 总监级及以上决策者
62% Director-Level and Above
100% 付费专业观众100% Paid Professional Attendees覆盖 50+ 国家与地区
Covering 50+ Countries and Regions
六大核心展区 / SIX EXHIBITION ZONES
One · AI算力与端侧智能 AI Compute & On-Device Intelligence
抢占万亿端侧AI市场 · 一站链接算力到终端全产业链 Capture the Trillion-Yuan On-Device AI Market · One-Stop Connection from Silicon to Terminal
Two · 消费科技与智能生活 Consumer Technology & Smart Living
聚焦全球1.03万亿美元市场 · 站上消费科技新生态核心舞台 The USD 1.03 Trillion Global Market · Exhibit at the Center of the New Consumer Tech Ecosystem
Three · AI数字健康与智慧医疗 AI Digital Health & Smart Healthcare
1500亿+AI健康市场 · AI从辅助走向诊疗核心 RMB 150 Billion+ AI Health Market · AI Moves from Assistant to Core
Four · 具身智能与智能装备 Embodied Intelligence & Smart Equipment
2027年1.25万亿市场 · 直通量产，站上风口 RMB 1.25 Trillion by 2027 · Exhibit at the Inflection Point, Connect Directly to Mass Production
Five · 6G、量子信息与智慧基础设施 6G, Quantum Information & Smart Infrastructure
2027关键窗口期 · 抢占下一代信息技术制高点
2027 Is the Critical Window · Secure the Next-Generation Information Technology High Ground
Six · 创新孵化与资本对接
Innovation Incubation & Capital Connection
万亿资本圈 · 直通孵化全链条
A Trillion-Yuan Capital Ecosystem · Connect Directly to the Full Incubation Chain
2027.6.26-28 · 北京亦创国际会展中心 / Beijing Etrong International Center
READ THE FULL WHITE PAPER
以上为白皮书核心摘要The above is a summary of the white paper完整内容请浏览原文Please read the full version for complete details
组委会联络方式 / CONTACT
TEL 400-8939-833
EMAIL ces@cesasia.ink
WEB www.cesasia.in
© 2027 SAI Expo Co., Ltd. ｜ Organizing Committee